At the OFC Fraunhofer Heinrich Hertz Institute presents its Photonic Integration Toolbox, InP Lasers for Integration into Silicon Photonics, PolyBoard and the LED based Optical Wireless Backhaul Link. Meet our experts at the booth 3013 on March 22-24 in Anaheim (California), United States.
You find the following highlights at our booth 3013.
InP Foundry Services – Photonic Integration Toolbox Design your own InP PIC with passives and actives on one substrate. You can choose from a range of proven building blocks e.g. 40 GHz receivers, 20 GHz transmitters, 1 dB/cm passive waveguides. Rx-type as well as Tx/Rx-type PICs are already commercially. Dedicated design and layout software is provided and packaging partners are available.
InP Lasers for Integration into Silicon Photonics – Optical Sources for Si-Photonics Fraunhofer HHI provides DFB lasers, gain chips and SOAs with flip chip capability for hybrid integration on Si-Platforms. Single devices and arrays are offered for lateral and vertical coupling schemes. InGaAsP and InGaAlAs is used as active MQW layer and operating wavelengths range from 1270 nm to 1650 nm.
PolyBoard Foundry Services Fraunhofer HHI develops photonic components and integrated circuits according to customer needs and specifications. The PolyBoard technology platform allows for rapid prototyping, short iteration cycles and low upfront development effort. Fraunhofer HHI offers a service package including simulation, CAD, technology development, device manufacturing, characterization, and qualification.
LED based Optical Wireless Backhaul Link Robust, low latency infrared LED link for mobile backhaul. Well suited for wireless point-to-point communication in industrial environments.